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Process Improvement in Volume Resistivity Detection of Semi-Conductive Shield for Large-Scale Cables

Time: 2025-03-14 16:28:11 Source: Henan Province Jianyun Cable Co., Ltd.


Introduction

The volume resistivity of semi-conductive shields plays a crucial role in determining the electrical performance of high-voltage cables. These shields help regulate electric field distribution, reduce partial discharge, and enhance insulation stability. However, traditional detection methods for large-scale cables suffer from several challenges:
Manual sample preparation results in uneven surfaces, leading to inconsistent test data.
Low testing efficiency makes large-scale quality control difficult.
Current resistivity measurement techniques lack precision, particularly for high-resistance samples.

This study proposes an improved testing process using large-scale cutting machines, fixed mold techniques, and copper sheet molds to enhance the accuracy and reliability of volume resistivity detection for semi-conductive shields in large-diameter cables (64/110 kV and above).


1. Key Challenges in Current Testing Methods

1.1 Sample Preparation Issues

Large-diameter cables require precise sample preparation, but manual cutting methods introduce several problems:

  • Irregular sample surfaces → Affects contact between electrodes and sample.
  • Low efficiency → Time-consuming manual operations slow down testing.
  • High rejection rates → Errors in cutting lead to wasted samples.
Factor Manual Cutting Large-Scale Cutting Machine
Surface Quality Rough, uneven Smooth, precise
Cutting Time Long (5–10 min per sample) Short (1–2 min per sample)
Safety Risk of hand injuries Controlled cutting process

Conclusion: Upgrading to large-scale cutting machines significantly improves efficiency and safety.

1.2 Problems in Volume Resistivity Measurement

A. Conductor Shield Resistivity Testing Issues

Traditional conductive paste coating method for resistivity testing suffers from:

  • Long curing times (12+ hours at room temperature).
  • Electrode damage due to sharp contact points.

B. Insulation Shield Resistivity Testing Issues

The self-adhesive copper tape method, commonly used for insulation shields, has drawbacks:

  • Weak adhesion at high temperatures (90°C) → Copper tape falls off.
  • Uneven contact with the sample, causing measurement errors.

Conclusion: A more stable and repeatable resistivity testing process is needed.


2. Proposed Process Improvements

2.1 Upgraded Sample Preparation Method

Large-scale cutting machines were introduced to replace manual cutting, ensuring smooth, uniform sample surfaces.
Effect: Increased efficiency, improved cutting accuracy, and reduced sample waste.

2.2 Improved Volume Resistivity Testing Techniques

A. Copper Sheet Mold Method (Replacing Conductive Paste Method)

Pre-fabricated copper sheet molds ensure stable contact with the sample.
Eliminates long curing times, improving testing speed.

B. Fixed Mold Method (Replacing Self-Adhesive Copper Tape Method)

✔ Uses a tight-fit mold to secure copper electrodes against the sample.
Prevents detachment at high temperatures, ensuring reliable data collection.

Method Advantages Replaced Method
Copper Sheet Mold Fast, repeatable, high accuracy Conductive paste method
Fixed Mold No adhesive issues, stable contact Self-adhesive copper tape

Effect: Enhanced measurement consistency, reducing error rates.


3. Experimental Validation and Results

3.1 Sample Quality Comparison

Cutting Method Surface Smoothness Preparation Time
Manual Cutting Uneven ~10 min/sample
Large-Scale Cutting Smooth ~2 min/sample

Key Finding: Automated cutting ensures smoother samples and faster preparation.

3.2 Volume Resistivity Test Results

Tested on 64/110 kV cables with different cross-sectional areas:

A. Conductor Shield Resistivity Results

Method Volume Resistivity (Ω·m) after Heating
Conductive Paste 6.62 (0.5h) → 5.90 (1.5h)
Copper Sheet Mold 5.91 (0.5h) → 5.66 (1.5h)

Copper sheet method consistently produced lower and more stable resistance values.

B. Insulation Shield Resistivity Results

Method Volume Resistivity (Ω·m) after Heating
Self-Adhesive Copper Tape 5.69 (0.5h) → 1.82 (1.5h)
Fixed Mold 1.71 (0.5h) → 1.69 (1.5h)

Fixed mold method significantly reduced resistance fluctuations, ensuring measurement accuracy.


4. Engineering Insights and Industry Implications

4.1 Impact on Quality Control

Higher repeatability → Eliminates sample variation.
Reduced testing time → Increases productivity in manufacturing QC labs.

4.2 Economic and Industrial Benefits

Aspect Improvement
Production Efficiency +30% faster testing cycle
Testing Cost -20% material waste reduction
Compliance with Standards Meets GB/T 11017.1-2014 requirements

Manufacturers can improve efficiency while maintaining high-quality standards.


5. Conclusion and Recommendations

5.1 Summary of Key Improvements

Large-scale cutting machines enhance sample preparation efficiency.
Copper sheet molds eliminate inconsistencies in conductor shield resistivity testing.
Fixed mold technique ensures reliable insulation shield resistivity measurement.

5.2 Future Research Directions


  • AI-driven automation for real-time defect detection.
  • Advanced materials for better shield conductivity and stability.
  • Integration with smart monitoring systems for in-line testing.


Final Verdict: These improvements enhance testing accuracy and efficiency, making them highly beneficial for large-scale cable manufacturers.


Keywords

  • Large-Scale Cables
  • Semi-Conductive Shield
  • Volume Resistivity Testing
  • High-Voltage Power Cables
  • Quality Control in Cable Manufacturing

References

  1. Li Mei (2025). Process Improvement in Volume Resistivity Detection of Semi-Conductive Shield for Large-Scale Cables. Wire & Cable, 68(1), 55-60. DOI: 10.16105/j.dxdl.1672-6901.20240095
  2. GB/T 11017.1-2014Test Methods for High Voltage Power Cable Shielding
  3. GB/T 3048.3-2007Electrical Performance Testing of Semi-Conductive Materials